Products Description
The XW-1100X-SPC-16M magnetron sputtering coater is a sophisticated instrument designed for thin film deposition through the process of physical vapor deposition (PVD). This technology leverages the sputtering effect, where high-energy particles bombard a target material in a vacuum environment, causing atoms or molecules to be ejected from the target’s solid surface. These ejected particles then travel through the vacuum and deposit onto a substrate, forming a thin film.
This compact and efficient coater is particularly well-suited for laboratory applications, such as preparing samples for scanning electron microscopy (SEM). Its small footprint makes it an ideal choice for laboratories with limited space, while its user-friendly interface ensures ease of operation, making it accessible even for beginners. The XW-1100X-SPC-16M thus combines advanced PVD technology with practical design, offering a reliable solution for thin film preparation in research and academic settings.
Features
- It is equipped with vacuum meter and sputtering current meter, which can monitor the working status in real time.
- By adjusting the sputtering current controller and micro vacuum gas valve, it controls the vacuum chamber pressure, ionization current and selects the required ionization gas to obtain the best coating effect.
- The rubber sealing ring on the edge of the bell housing is specially designed to ensure that the glass bell housing will not be chipped in long-term use.
- Ceramic-sealed high-voltage electrode fittings are more durable than the rubber seals normally used.
- According to the ionization characteristics of the gas in the electric field, a large-capacity sputtering vacuum chamber and a corresponding area of the sputtering target are used to make the sputtered layer more uniform and pure.
- The sputter head utilizes Peltier cooling technology to obtain high performance, fine particle coatings.
- Water-cooled sputter heads and water-cooled carrier tables are available.
Technical Parameters
| Product Name | Vacuum Magnetron Sputtering Coating Machine |
| Product Model | XW-1100X-SPC-16M |
| Installation Condition | This equipment is required to be used at an altitude of 1000m or less, at a temperature of 25℃±15℃and a humidity of 55%Rh±10%Rh. |
| 1. water: the equipment needs to be equipped with optional self-circulating cooling water machine (filling pure water or deionized water) | |
| 2. electricity: AC220V 50Hz, must have a good grounding | |
| 3. gas: equipment chamber to be filled with argon (purity 99.99% or more), need to provide their own argon gas cylinder (with pressure reducing valve) | |
| 4. Working table: size 600mm×600mm×700mm, load-bearing 50kg or more. | |
| 5. Ventilation device: not required | |
| Major Parameter | 1. Target: Ø50mm |
| 2. Vacuum chamber: Ø160mm×120mm | |
| 3. vacuum degree:≤4×10-2mbar | |
| 4, max current: 50mA (optional 100mA) | |
| 5. Limit time can be set: 9999s | |
| 6. Micro vacuum valve: Connect Ø3mm hose | |
| 7. limit voltage: 1600V DC | |
| 8. mechanical pump: 2L/s | |
| 9. Target material: | |
| Size requirement:φ50mm×(0.1-0.5)mm(thickness) | |
| Suitable for sputtering Au, Ag, Cu and other metals (available in our company) | |
| 10. Size: 360mm×300mm×380mm | |
| Overall weight: 50Kg, Net weight: 15Kg |
